FILM FORMING EQUIPMENT FOR SUBSTRATE
PROBLEM TO BE SOLVED: To provide film forming equipment for a substrate, which can heat the substrate with an approximately uniform temperature-distribution in a short time, when heating the substrate in a film forming process. SOLUTION: The film forming equipment for the substrate comprises, an ele...
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| creator | FUJIMOTO TOMOHITO FUJIKAWA JUNJI |
| description | PROBLEM TO BE SOLVED: To provide film forming equipment for a substrate, which can heat the substrate with an approximately uniform temperature-distribution in a short time, when heating the substrate in a film forming process. SOLUTION: The film forming equipment for the substrate comprises, an electrode holder 2 for mounting and holding the substrate, a mask 5 for partially covering the surface of the substrate G, which is attached to the electrode holder 2, a heating means 3 for heating the substrate G, a film material 4 for forming the film layer by sticking to the surface of the substrate G, a vacuum chamber 1 for holding the inside to a vacuum condition, which accommodates all these, and the mask 5 is attached to the electrode holder 2 with such a narrow bonding area as to limit the thermal conduction. |
| format | Patent |
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SOLUTION: The film forming equipment for the substrate comprises, an electrode holder 2 for mounting and holding the substrate, a mask 5 for partially covering the surface of the substrate G, which is attached to the electrode holder 2, a heating means 3 for heating the substrate G, a film material 4 for forming the film layer by sticking to the surface of the substrate G, a vacuum chamber 1 for holding the inside to a vacuum condition, which accommodates all these, and the mask 5 is attached to the electrode holder 2 with such a narrow bonding area as to limit the thermal conduction.</description><edition>7</edition><language>eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020710&DB=EPODOC&CC=JP&NR=2002194528A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020710&DB=EPODOC&CC=JP&NR=2002194528A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUJIMOTO TOMOHITO</creatorcontrib><creatorcontrib>FUJIKAWA JUNJI</creatorcontrib><title>FILM FORMING EQUIPMENT FOR SUBSTRATE</title><description>PROBLEM TO BE SOLVED: To provide film forming equipment for a substrate, which can heat the substrate with an approximately uniform temperature-distribution in a short time, when heating the substrate in a film forming process. SOLUTION: The film forming equipment for the substrate comprises, an electrode holder 2 for mounting and holding the substrate, a mask 5 for partially covering the surface of the substrate G, which is attached to the electrode holder 2, a heating means 3 for heating the substrate G, a film material 4 for forming the film layer by sticking to the surface of the substrate G, a vacuum chamber 1 for holding the inside to a vacuum condition, which accommodates all these, and the mask 5 is attached to the electrode holder 2 with such a narrow bonding area as to limit the thermal conduction.</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFBx8_TxVXDzD_L19HNXcA0M9QzwdfULAYkoBIc6BYcEOYa48jCwpiXmFKfyQmluBiU31xBnD93Ugvz41OKCxOTUvNSSeK8AIwMDI0NLE1MjC0djohQBAM8ZI5c</recordid><startdate>20020710</startdate><enddate>20020710</enddate><creator>FUJIMOTO TOMOHITO</creator><creator>FUJIKAWA JUNJI</creator><scope>EVB</scope></search><sort><creationdate>20020710</creationdate><title>FILM FORMING EQUIPMENT FOR SUBSTRATE</title><author>FUJIMOTO TOMOHITO ; FUJIKAWA JUNJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2002194528A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>FUJIMOTO TOMOHITO</creatorcontrib><creatorcontrib>FUJIKAWA JUNJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUJIMOTO TOMOHITO</au><au>FUJIKAWA JUNJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FILM FORMING EQUIPMENT FOR SUBSTRATE</title><date>2002-07-10</date><risdate>2002</risdate><abstract>PROBLEM TO BE SOLVED: To provide film forming equipment for a substrate, which can heat the substrate with an approximately uniform temperature-distribution in a short time, when heating the substrate in a film forming process. SOLUTION: The film forming equipment for the substrate comprises, an electrode holder 2 for mounting and holding the substrate, a mask 5 for partially covering the surface of the substrate G, which is attached to the electrode holder 2, a heating means 3 for heating the substrate G, a film material 4 for forming the film layer by sticking to the surface of the substrate G, a vacuum chamber 1 for holding the inside to a vacuum condition, which accommodates all these, and the mask 5 is attached to the electrode holder 2 with such a narrow bonding area as to limit the thermal conduction.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | FILM FORMING EQUIPMENT FOR SUBSTRATE |
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