FILM FORMING EQUIPMENT FOR SUBSTRATE

PROBLEM TO BE SOLVED: To provide film forming equipment for a substrate, which can heat the substrate with an approximately uniform temperature-distribution in a short time, when heating the substrate in a film forming process. SOLUTION: The film forming equipment for the substrate comprises, an ele...

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Bibliographische Detailangaben
Hauptverfasser: FUJIMOTO TOMOHITO, FUJIKAWA JUNJI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide film forming equipment for a substrate, which can heat the substrate with an approximately uniform temperature-distribution in a short time, when heating the substrate in a film forming process. SOLUTION: The film forming equipment for the substrate comprises, an electrode holder 2 for mounting and holding the substrate, a mask 5 for partially covering the surface of the substrate G, which is attached to the electrode holder 2, a heating means 3 for heating the substrate G, a film material 4 for forming the film layer by sticking to the surface of the substrate G, a vacuum chamber 1 for holding the inside to a vacuum condition, which accommodates all these, and the mask 5 is attached to the electrode holder 2 with such a narrow bonding area as to limit the thermal conduction.