METHOD FOR ANALYZING MINUTE FOREIGN MATTER, ANALYSIS APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE

PROBLEM TO BE SOLVED: To provide a method and an apparatus whereby a position of a minute foreign matter on a sample surface is detected again on an analysis apparatus efficiently and highly accurately without damaging a light-receiving device when the minute foreign matter is analyzed with the use...

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Bibliographische Detailangaben
1. Verfasser:	FUJINO NAOHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBEMICROSCOPY [SPM] BASIC ELECTRIC ELEMENTS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SCANNING-PROBE TECHNIQUES OR APPARATUS SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TESTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method and an apparatus whereby a position of a minute foreign matter on a sample surface is detected again on an analysis apparatus efficiently and highly accurately without damaging a light-receiving device when the minute foreign matter is analyzed with the use of a foreign matter- inspecting apparatus and the analysis apparatus. SOLUTION: There is provided a position detection process in the analysis apparatus in which the position on the sample surface of the minute foreign matter is detected again on the analysis apparatus 10. The position detection process includes a combination selection process for estimating a signal strength at the light-receiving device with the use of size information or scattering light intensity information of the minute foreign matter obtained by the foreign matter-inspecting apparatus 30 and, selecting a combination of an intensity of a beam light 23 and a gain of the light-receiving device 5.