CONDUCTIVE RESIN COMPOSITION AND CONDUCTIVE INJECTION- MOLDED PRODUCT

PROBLEM TO BE SOLVED: To provide a conductive resin composition suitable for a molding material for a tray or the like for carrying high-density electronic devices and capable of providing a conductive injection-molded product exerting excellent conductivity and having little dispersion in a surface...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TANAKA TOMOHIKO, SAGISAKA KOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRICITY GENERAL PROCESSES OF COMPOUNDING INSULATORS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a conductive resin composition suitable for a molding material for a tray or the like for carrying high-density electronic devices and capable of providing a conductive injection-molded product exerting excellent conductivity and having little dispersion in a surface resistance value depending on a place of the molded product even if it is formed into a molten molded product for injection molding or the like, and to provide a conductive injection- molded product made by injection-molding the conductive resin composition. SOLUTION: This conductive resin composition is prepared by adding 0.5-30 parts by volume of aluminum borate powder and/or aluminum borate whiskers (B) to 100 parts by volume of a main component (A) containing a thermoplastic resin and carbon fibrils having a fiber diameter