METHOD AND SYSTEM FOR DEPOSITING TRANSPARENT CONDUCTIVE FILM OR THE LIKE

PROBLEM TO BE SOLVED: To provide a method and a system for depositing a transparent conductive film or the like which are suitably used for depositing an ITO film or the like onto a color filter, a plastic film, etc. SOLUTION: The transparent conductive film can be deposited at low sputter voltage b...

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Bibliographische Detailangaben
Hauptverfasser:	YAMADA TAKAHARU, KITAHATA AKIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CONDUCTORS DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INSULATORS METALLURGY SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method and a system for depositing a transparent conductive film or the like which are suitably used for depositing an ITO film or the like onto a color filter, a plastic film, etc. SOLUTION: The transparent conductive film can be deposited at low sputter voltage by applying DC voltage alternately to at least a couple of targets provided inside a vacuum chamber to move electrons between the targets, synchronously applying, when negative voltage is applied to one target, high-frequency voltage to the target to which negative voltage is applied, and repeating the above procedure.