RESIN COMPOSITION FOR ADHESION AND SEALING

PROBLEM TO BE SOLVED: To enable a constant adhesive strength to be secured, a stuck part to be easily separated in a comparatively low-temperature condition, and a new part to be stuck thereto again without problems. SOLUTION: This thermoset type resin composition comprises an oxetane resin as a the...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	IMAIZUMI NOBUHIRO, YAGI TOMOHISA
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To enable a constant adhesive strength to be secured, a stuck part to be easily separated in a comparatively low-temperature condition, and a new part to be stuck thereto again without problems. SOLUTION: This thermoset type resin composition comprises an oxetane resin as a thermoset resin, a thermoplastic resin and a curing agent. Preferably, the oxetane resin is selected from the group consisting of bis(oxetane) carbonate, bis(oxetane) adipate, xylylene-bis(oxetane), 3-ethyl-3-hydroxymethyloxetane and benzyloxetane.