ZERO THERMAL EXPANSION MATERIAL

PROBLEM TO BE SOLVED: To make thermal expansion nearly zero by introducing a third element into a metal oxide indicating a negative thermal expansion and suppressing the shrinkage thereof. SOLUTION: The third element is introduced into the spacings between ligand structures consisting of metal and o...

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Bibliographische Detailangaben
1. Verfasser:	NICHOGI KATSUHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	ARTIFICIAL STONE CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CEMENTS CERAMICS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSESC01D OR C01F COMPOUNDS THEREOF CONCRETE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INORGANIC CHEMISTRY LIME, MAGNESIA MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY NON-METALLIC ELEMENTS PRINTED CIRCUITS REFRACTORIES SLAG TREATMENT OF NATURAL STONE
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To make thermal expansion nearly zero by introducing a third element into a metal oxide indicating a negative thermal expansion and suppressing the shrinkage thereof. SOLUTION: The third element is introduced into the spacings between ligand structures consisting of metal and oxygen to suppress the deviation in the rotating direction of the ligand which is the cause for the negative thermal expansion, by which the material substantially free of the thermal expansion is provided.