INTELLIGENT POWER MODULE PACKAGE

PROBLEM TO BE SOLVED: To provide an intelligent power module package having a power portion including a heat sink and a control portion separate from the power portion and stacked on the power portion. SOLUTION: The power portion and the control portion of the intelligent power module are stacked mu...

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Bibliographische Detailangaben
Hauptverfasser:	IM EUL-BIN, KIM BYEONG GON, JEON GI-YOUNG, LIM SEUNG-WON, ZEN GOSHO, KIM SEUNG-JIN, CHOI SEUNG-YONG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an intelligent power module package having a power portion including a heat sink and a control portion separate from the power portion and stacked on the power portion. SOLUTION: The power portion and the control portion of the intelligent power module are stacked mutually in a lead frame configuration after a wire bonding and also stacked mutually in a semiconductor package configuration using a locking method after a molding, trimming/forming and an electrical characteristic testing.