CHUCK ASSEMBLY FOR PROBE STATION

PROBLEM TO BE SOLVED: To obtain a chuck assembly having a reduced shaking and stress that acts on a plunger, which enables arranging of a wafer on a probe more easily and correctly, during inspecting the wafer and the like by the probe. SOLUTION: This chuck assembly is provided with an adjustment pl...

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Hauptverfasser: NORDGREN GREG, DUNKLEE JOHN
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creator NORDGREN GREG
DUNKLEE JOHN
description PROBLEM TO BE SOLVED: To obtain a chuck assembly having a reduced shaking and stress that acts on a plunger, which enables arranging of a wafer on a probe more easily and correctly, during inspecting the wafer and the like by the probe. SOLUTION: This chuck assembly is provided with an adjustment plate 182, which is freely rotatable toward the chuck assembly, suitable for supporting the chuck and has a tab 203 and a plunger 200. The plunger 200 that is connected to the adjustment plate has a receptacle 201, by the rotations of which the adjustment plate is rotated selectively. A position stage 184 has a pair of straight bearings and is a basic insulator for supporting for the adjustment plate. A downward force will not be applied to the plunger, while the adjustment plate is being rotated and activated by the plunger.
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SOLUTION: This chuck assembly is provided with an adjustment plate 182, which is freely rotatable toward the chuck assembly, suitable for supporting the chuck and has a tab 203 and a plunger 200. The plunger 200 that is connected to the adjustment plate has a receptacle 201, by the rotations of which the adjustment plate is rotated selectively. A position stage 184 has a pair of straight bearings and is a basic insulator for supporting for the adjustment plate. A downward force will not be applied to the plunger, while the adjustment plate is being rotated and activated by the plunger.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20020607&amp;DB=EPODOC&amp;CC=JP&amp;NR=2002164396A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20020607&amp;DB=EPODOC&amp;CC=JP&amp;NR=2002164396A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NORDGREN GREG</creatorcontrib><creatorcontrib>DUNKLEE JOHN</creatorcontrib><title>CHUCK ASSEMBLY FOR PROBE STATION</title><description>PROBLEM TO BE SOLVED: To obtain a chuck assembly having a reduced shaking and stress that acts on a plunger, which enables arranging of a wafer on a probe more easily and correctly, during inspecting the wafer and the like by the probe. 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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
title CHUCK ASSEMBLY FOR PROBE STATION
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