CHUCK ASSEMBLY FOR PROBE STATION

PROBLEM TO BE SOLVED: To obtain a chuck assembly having a reduced shaking and stress that acts on a plunger, which enables arranging of a wafer on a probe more easily and correctly, during inspecting the wafer and the like by the probe. SOLUTION: This chuck assembly is provided with an adjustment pl...

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Bibliographische Detailangaben
Hauptverfasser:	NORDGREN GREG, DUNKLEE JOHN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a chuck assembly having a reduced shaking and stress that acts on a plunger, which enables arranging of a wafer on a probe more easily and correctly, during inspecting the wafer and the like by the probe. SOLUTION: This chuck assembly is provided with an adjustment plate 182, which is freely rotatable toward the chuck assembly, suitable for supporting the chuck and has a tab 203 and a plunger 200. The plunger 200 that is connected to the adjustment plate has a receptacle 201, by the rotations of which the adjustment plate is rotated selectively. A position stage 184 has a pair of straight bearings and is a basic insulator for supporting for the adjustment plate. A downward force will not be applied to the plunger, while the adjustment plate is being rotated and activated by the plunger.