LAMINATE FOR PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a laminate for manufacturing a printed wiring board capable of being increased in the density of wirings and reduced in thickness, good in heat resistance, adhesiveness, durability and dimensional accuracy and capable of being reduced in weight and thickness, and a m...

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Bibliographische Detailangaben
Hauptverfasser:	KASATANI HIDEO, YAMADA TAKASHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a laminate for manufacturing a printed wiring board capable of being increased in the density of wirings and reduced in thickness, good in heat resistance, adhesiveness, durability and dimensional accuracy and capable of being reduced in weight and thickness, and a method for manufacturing a built-up multilayered printed wiring boad using the laminate. SOLUTION: An epoxy resin composition layer of which the glass transition temperature after curing is 150 deg.C or higher is formed on the single surface of a heat-resistant film of which the surface oxygen atom content measured by X-ray photoelectron spectroscopy(XPS) is 15% or more and the thickness is 20 μm or less and a copper foil is bonded to the other surface of the heat- resistant film through an epoxy resin composition of which the glass transition temperature is 150 deg.C or higher to form the laminate for the built-up multilayered printed wiring boad. The laminate is used to manufacture the built-up multilayered printed wiring boad.