PHOTOCOUPLER

PROBLEM TO BE SOLVED: To provide a thin photocoupler in which positional accuracy of optical axis is high and a large diameter lens can be used. SOLUTION: A chip carrier 3 has a protruding rail guide 6 formed on the surface opposite to the surface mounting optical semiconductor elements 1 and 2. A s...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	FUKUDA KAZUYUKI, FUJIWARA YOSHITAKA, OTSUKI MASANORI, YAMASHITA TAKESHI, SHIMAOKA MAKOTO, KUWANO HIDEYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a thin photocoupler in which positional accuracy of optical axis is high and a large diameter lens can be used. SOLUTION: A chip carrier 3 has a protruding rail guide 6 formed on the surface opposite to the surface mounting optical semiconductor elements 1 and 2. A substrate member 5 has a recessed rail groove 7 made on the surface thereof and aligned with the protruding rail guide 6. The protruding rail guide 6 is fitted in the recessed rail groove 7, the chip carrier 3 is mounted on the substrate member 5 and a lens 4 is set directly in the recessed rail groove 7 of the substrate member 5.