MOUNTING STRUCTURE, ITS MANUFACTURING METHOD AND CONDUCTIVE ADHESIVE

PROBLEM TO BE SOLVED: To provide a mounting structure having excellent insulating reliability and sulfurization resistance. SOLUTION: The mounting structure comprises a conductive adhesive layer 1A constituted of a conductive adhesive 1 having a charge transfer metal complex 3 at least at a part of...

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Bibliographische Detailangaben
Hauptverfasser:	TAKEZAWA HIROTERU, KITAE TAKASHI, NISHIYAMA TOSAKU, ISHIMARU YUKIHIRO, MITANI TSUTOMU
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a mounting structure having excellent insulating reliability and sulfurization resistance. SOLUTION: The mounting structure comprises a conductive adhesive layer 1A constituted of a conductive adhesive 1 having a charge transfer metal complex 3 at least at a part of a conductive filler 2.