MANUFACTURING METHOD OF SEMICONDUCTOR

PROBLEM TO BE SOLVED: To provide an inexpensive semiconductor manufacturing device, realizing small foot print and small phase print. SOLUTION: In the compact semiconductor manufacturing device of a single- wafer processing for processing a semiconductor substrate, at least two units, constituted of...

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Bibliographische Detailangaben
Hauptverfasser:	WATABE TSUYOSHI, YAMAGISHI TAKAYUKI, SUWADA MASAE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CONVEYING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PACKING PERFORMING OPERATIONS PNEUMATIC TUBE CONVEYORS SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING
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