MANUFACTURING METHOD OF SEMICONDUCTOR

PROBLEM TO BE SOLVED: To provide an inexpensive semiconductor manufacturing device, realizing small foot print and small phase print. SOLUTION: In the compact semiconductor manufacturing device of a single- wafer processing for processing a semiconductor substrate, at least two units, constituted of reactors for growing the films on the semiconductor substrate and load lock chambers which are connected directly to the reactors through a gate valve and which are for making the semiconductor substrate wait in vacuum, are connected and are made into modules. The reactor unit which is made into the module can be made into a cluster via AFE. A substrate transport mechanism, constituted of a thin link-type arm for transporting the semiconductor device to the reactor, is given inside the load lock chamber.