DETECTION METHOD FOR SURFACE CONDITION AND MANUFACTURING METHOD OF MICRODEVICE
PROBLEM TO BE SOLVED: To provide a detection method for surface conditions, for detecting the surface condition of a substrate and the like with high accuracy, without causing enlarging of the system size, and deterioration in positional information of the substrate and in positional alignment accur...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a detection method for surface conditions, for detecting the surface condition of a substrate and the like with high accuracy, without causing enlarging of the system size, and deterioration in positional information of the substrate and in positional alignment accuracy, while preventing decrease in manufacturing efficiency. SOLUTION: An imaging position of a projecting optical system PL is sought, and while the condition of upper faces of reference reflecting plates FM1 and FM2 are aligned at the imagery position of the projecting optical system PL, individual positional information of the upper faces of the reference reflecting plates FM1 and FM2 in Z-axis direction is detected by a position detector, having a light irradiating system 26a and the light-receiving system 26b. The detecting light beam is passed sequentially through the reference reflecting plates FM1 and FM2 by a surface condition detector having a light irradiating system 27a, a relay system 27b, and a light-receiving system 27c, and the sum of the positional information of the upper face of the reference reflecting plate FM1 in Z-axis direction and the positional information of the upper face of the reference reflecting plate FM2 in the Z-axis direction is sought. Then, the surface condition detector is corrected by comparison, based on the detected result of the positional detector and the face condition detector. |
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