LOW-TEMPERATURE FIRED CERAMICS AND WIRING SUBSTRATE

PROBLEM TO BE SOLVED: To provide a low-temperature fired ceramics suitable for an insulation board of a wiring board whose thermal expansion coefficient and strength are high, and decrease in strength after heat cycle is low, and the wiring board using the above. SOLUTION: The low-temperature fired...

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Bibliographische Detailangaben
Hauptverfasser:	FUKUDA KENJIRO, AZUMA MASAHIKO, NAKAO YOSHIHIRO, KOKUBU MASAYA, FURUKUBO YOJI
Format:	Patent
Sprache:	eng
Schlagworte:	ARTIFICIAL STONE BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CEMENTS CERAMICS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LIME, MAGNESIA MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS REFRACTORIES SEMICONDUCTOR DEVICES SLAG TREATMENT OF NATURAL STONE
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a low-temperature fired ceramics suitable for an insulation board of a wiring board whose thermal expansion coefficient and strength are high, and decrease in strength after heat cycle is low, and the wiring board using the above. SOLUTION: The low-temperature fired ceramics which is used as the insulation board 1 of the wiring board A contains at least a barium silicate crystal (BS) of 30-70 wt.% and a quartz crystal (S) of 30-70 wt.%.