HIGH-SPEED CIRCUIT BOARD INTERCONNECTION

PROBLEM TO BE SOLVED: To provide an electrical interconnection between circuit boards. SOLUTION: The interconnection includes at least one circuit board (12) having major surfaces (13 and 14) and having a signal pin hole (31), a grounding pin hole (32) and pattern via holes (34 to 37) extended there...

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Bibliographische Detailangaben
Hauptverfasser:	STEVEN P O'NEIL, FU HUI, BOSCH FRIDOLIN LUDWIG, KARNACEWICZ MARK
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE WAVEGUIDES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electrical interconnection between circuit boards. SOLUTION: The interconnection includes at least one circuit board (12) having major surfaces (13 and 14) and having a signal pin hole (31), a grounding pin hole (32) and pattern via holes (34 to 37) extended therethrough between the major surfaces. The via holes surround the signal pin holes to be electrically connected to a D.C. grounding plane (15) formed within the substrate. Grounding and signal pins (16) and (17) are mounted in the grounding and signal pin holes to extend exceeding at least one of surfaces thereof, respectively. A conductive shield (18) surrounds at least part of the signal pin extended exceeding the surface.