FILM THICKNESS MEASURING DEVICE

PROBLEM TO BE SOLVED: To provide a film thickness measuring device capable of improving throughput by sequence selection function matched with a manufacturing process on each user and the automatic optimum software of processing procedure. SOLUTION: In the film thickness measuring device provided wi...

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Bibliographische Detailangaben
Hauptverfasser:	OTSUKI KUNIO, KO MASAAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a film thickness measuring device capable of improving throughput by sequence selection function matched with a manufacturing process on each user and the automatic optimum software of processing procedure. SOLUTION: In the film thickness measuring device provided with the conveyor D of a specimen, measuring the thickness of a thin film formed on the surface of the specimen and displaying the measured result on the display screen 28a of a data processor 27, measuring requirement items, the conveying capability of the conveyor including wafer conveying speed, and a processing time comparison table 30 displaying the processing capability of an analyzer can be displayed on the display screen 28a.