HIGH THERMAL CONDUCTIVE SILICON NITRIDE CERAMIC AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To obtain a silicon nitride sintered body which enables the densification and grain growth of a sintered body by a low temperature sintering of =100 W/mK. SOLUTION: When a high thermal conductive silicon nitride sintered body is manufactured so that the densification and grain...

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Hauptverfasser: ITAYA SEIJI, HIRAO KIYOSHI, HAYASHI HIROYUKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To obtain a silicon nitride sintered body which enables the densification and grain growth of a sintered body by a low temperature sintering of =100 W/mK. SOLUTION: When a high thermal conductive silicon nitride sintered body is manufactured so that the densification and grain growth of a sintered body are enabled by low temperature sintering of