FLOW SOLDERING METHOD AND DEVICE

FLOW SOLDERING METHOD AND DEVICE

PROBLEM TO BE SOLVED: To provide a flow-soldering method for packaging an electronic component on a substrate by the use of a soldering material and suitable for using a lead-free soldering material as a soldering material. SOLUTION: In a material supply process of the flow-soldering method of packa...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SUETSUGU KENICHIRO, KABASHIMA YOSHIYUKI, NAKADA MIKIYA, MAEDA YUKIO, TAKANO HIROAKI, HIBINO TOSHIHARU, OKUCHI TATSUO, KAWASHIMA TAIJI
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PRINTED CIRCUITS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a flow-soldering method for packaging an electronic component on a substrate by the use of a soldering material and suitable for using a lead-free soldering material as a soldering material. SOLUTION: In a material supply process of the flow-soldering method of packaging an electronic component on a substrate by the use of a soldering material, a substrate is heated to a higher temperature. In one embodiment, a substrate 11 carried with an electronic component placed thereon is previously heated by the use of a pre-heater 3 under the substrate 11, and a heating cover 10 covering over the substrate 11 and a soldering material 4 is supplied to the previously heated substrate 11.