CIRCUIT PACKAGE

PROBLEM TO BE SOLVED: To provide a circuit package which has a package module with a small build. SOLUTION: This circuit package comprises a conductor belt as a base 211, a master chip 22, and a slave chip 23; and the master chip 22 is stuck on the base 211 on a flat packaging basis, the slave chip...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHENG CHUANG YUNG, WEN CHIANG HUA, JUI CHANG HSUAN, NING HUANG, CHANG TU FENG, HSIEN WEN-LO, CHIEH HU CHIA, YU HUANG FU, PIN CHEN HUI, MING CHANG CHUANG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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