CIRCUIT PACKAGE

CIRCUIT PACKAGE

PROBLEM TO BE SOLVED: To provide a circuit package which has a package module with a small build. SOLUTION: This circuit package comprises a conductor belt as a base 211, a master chip 22, and a slave chip 23; and the master chip 22 is stuck on the base 211 on a flat packaging basis, the slave chip...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHENG CHUANG YUNG, WEN CHIANG HUA, JUI CHANG HSUAN, NING HUANG, CHANG TU FENG, HSIEN WEN-LO, CHIEH HU CHIA, YU HUANG FU, PIN CHEN HUI, MING CHANG CHUANG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a circuit package which has a package module with a small build. SOLUTION: This circuit package comprises a conductor belt as a base 211, a master chip 22, and a slave chip 23; and the master chip 22 is stuck on the base 211 on a flat packaging basis, the slave chip 23 having a projection is stuck on the master chip 22 and base 211 on a flip-chip basis at the same time, and the master chip 22 and slave chip 23 are put one over the other. The height of the package composed of the master chip 22 and slave chip 23 is less than the overall thickness of a three-layered substrate.