SEMICONDUCTOR MANUFACTURING DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device which can cut a tie-bar of a sealed lead frame with high precision by using extra-high pressure water. SOLUTION: This semiconductor manufacturing device comprises a jet pressure adjustment part 5 which adjusts water supplied from...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KAWADA KEIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CUTTING CUTTING-OUT ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HAND CUTTING TOOLS PERFORATING PERFORMING OPERATIONS PUNCHING SEMICONDUCTOR DEVICES SEVERING SEVERING BY MEANS OTHER THAN CUTTING STAMPING-OUT TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!