SEMICONDUCTOR MANUFACTURING DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device which can cut a tie-bar of a sealed lead frame with high precision by using extra-high pressure water. SOLUTION: This semiconductor manufacturing device comprises a jet pressure adjustment part 5 which adjusts water supplied from...

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Bibliographische Detailangaben
1. Verfasser:	KAWADA KEIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CUTTING CUTTING-OUT ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HAND CUTTING TOOLS PERFORATING PERFORMING OPERATIONS PUNCHING SEMICONDUCTOR DEVICES SEVERING SEVERING BY MEANS OTHER THAN CUTTING STAMPING-OUT TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device which can cut a tie-bar of a sealed lead frame with high precision by using extra-high pressure water. SOLUTION: This semiconductor manufacturing device comprises a jet pressure adjustment part 5 which adjusts water supplied from a supply pipe 11 into extra-high pressure water 8, a nozzle head 6 which has a jet hole 7 for the extra-high pressure water 8 and is connected to the jet pressure adjustment part 5, a top metal mold 9 which is provided with a passage (through hole 16a) for the ultra-high pressure water 8 jetted out of the jet hole 7 and connected to the jet hole 7, and a bottom metal mold 10 which has a through hole 16b at the same position opposite the through hole 16a and is arranged below the top metal mold 9. A sealed lead frame is arranged between those molds, and a tie bar and dam resin are cut with the extra-high pressure water 8 jetted into the through hole 16a. The linearity of the extra-high pressure water is held by the through hole 16a, and high-precision machining is carried out.