FULL-AREA TEMPERATURE CONTROL ELECTROSTATIC CHUCK AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide an improved three-piece wafer support assembly which regulates temperature by holding a large-diameter semiconductor wafer. SOLUTION: A stage for mounting a ring which binds a cradle on the bottom face of a ceramic pack is included. A composite cooling plate structur...

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Bibliographische Detailangaben
1. Verfasser:	BIJAY D PALKE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING COLD ROOMS COMBINED HEATING AND REFRIGERATION SYSTEMS COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT PUMP SYSTEMS HEATING ICE-BOXES LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING REFRIGERATION OR COOLING REFRIGERATORS SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an improved three-piece wafer support assembly which regulates temperature by holding a large-diameter semiconductor wafer. SOLUTION: A stage for mounting a ring which binds a cradle on the bottom face of a ceramic pack is included. A composite cooling plate structure is brazed on the bottom face of the ceramic pack at low temperature, and a cradle binding ring surrounds the composite cooling plate structure. Thereafter, the cradle is welded on the cradle binding ring by an electron beam.