EPOXY RESIN COMPOSITION FOR INTERPOSER, PREPREG AND COPPER CLAD LAMINATED PLATE

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for an interposer which has excellent solder resistance by high heat resistance, low thermal expansion and a low water absorption property, to provide its prepreg, and to provide its cooper clad laminated plate. SOLUTION: The epoxy resin fo...

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Bibliographische Detailangaben
Hauptverfasser:	BABA TAKAYUKI, MIYAKE SUMIYA
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an epoxy resin composition for an interposer which has excellent solder resistance by high heat resistance, low thermal expansion and a low water absorption property, to provide its prepreg, and to provide its cooper clad laminated plate. SOLUTION: The epoxy resin for the interposer is composed of (A) an epoxy resin having structure represented by the following formula (1) (wherein, G represents a glycidyl group), (B) a phenol resin curing agent having three or more phenolic hydroxyl groups in one molecule, (C) a flame retardant and (D) a spherical molten silica as an essential component, and preferably, of (E) a coupling agent.