METHOD OF CONTROLLING RESONATOR BLANK WAFER POLISHING DEVICE

PROBLEM TO BE SOLVED: To obtain many effective measured signals by detecting a blank wafer under an electrode without fail. SOLUTION: A measured value of a frequency sweep initiation point is compared with a reference level (S1). If the measured value is small, a frequency sweep is reset (S10). If t...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	WAKAMOTO SATORU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRONIC CIRCUITRY DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING RESONATORS TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain many effective measured signals by detecting a blank wafer under an electrode without fail. SOLUTION: A measured value of a frequency sweep initiation point is compared with a reference level (S1). If the measured value is small, a frequency sweep is reset (S10). If the measured value is large, the frequency sweep is continued (S3), and a specified level lower than a level of the measured signal obtained by the frequency sweep is set as the next reference level (S6).