FLUX-APPLYING METHOD, FLOW SOLDERING METHOD, DEVICE FOR THE SAME AND ELECTRONIC CIRCUIT BOARD

PROBLEM TO BE SOLVED: To fully supply a solder material to a through-hole formed in a substrate by a spray-type flux applying method in a flow soldering process for mounting electronic components on the substrate, using the solder material. SOLUTION: In the flux-applying method for applying flux to...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SUETSUGU KENICHIRO, KABASHIMA YOSHIYUKI, NAKADA MIKIYA, MAEDA YUKIO, TAKANO HIROAKI, HIBINO TOSHIHARU, OKUCHI TATSUO, KAWASHIMA TAIJI
Format:	Patent
Sprache:	eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SOLDERING OR UNSOLDERING SPRAYING OR ATOMISING IN GENERAL TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!