FLUX-APPLYING METHOD, FLOW SOLDERING METHOD, DEVICE FOR THE SAME AND ELECTRONIC CIRCUIT BOARD

PROBLEM TO BE SOLVED: To fully supply a solder material to a through-hole formed in a substrate by a spray-type flux applying method in a flow soldering process for mounting electronic components on the substrate, using the solder material. SOLUTION: In the flux-applying method for applying flux to...

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Bibliographische Detailangaben
Hauptverfasser:	SUETSUGU KENICHIRO, KABASHIMA YOSHIYUKI, NAKADA MIKIYA, MAEDA YUKIO, TAKANO HIROAKI, HIBINO TOSHIHARU, OKUCHI TATSUO, KAWASHIMA TAIJI
Format:	Patent
Sprache:	eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SOLDERING OR UNSOLDERING SPRAYING OR ATOMISING IN GENERAL TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To fully supply a solder material to a through-hole formed in a substrate by a spray-type flux applying method in a flow soldering process for mounting electronic components on the substrate, using the solder material. SOLUTION: In the flux-applying method for applying flux to the substrate by jetting flux, including solvent and an active component toward the substrate in the flow soldering process for mounting the electronic components on the substrate using the solder material, jetted flux is stuck to the substrate while jetted flux substantially maintains a solution state. More specifically, a distance between a nozzle (6) for jetting flux (3) toward the substrate (1) and the substrate (1) positioned above the nozzle (6) is set to about 30 to 60 mm.