METHOD AND DEVICE FOR HANDLING SURFACE-PRESSING PLATE

PROBLEM TO BE SOLVED: To ensure attaching/detaching with less dust at delivery of a wafer by surely fixing the wafer, so that it will not be removed at handling in a violent gas flow. SOLUTION: At surface-processing of a wafer 10, while being placed on a process hand 46, the wafer 10 is grasped at m...

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1. Verfasser:	SONODA YUZURU
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To ensure attaching/detaching with less dust at delivery of a wafer by surely fixing the wafer, so that it will not be removed at handling in a violent gas flow. SOLUTION: At surface-processing of a wafer 10, while being placed on a process hand 46, the wafer 10 is grasped at multiple points, from the upper and lower surfaces using the process hand 46, where a surface processing target part is opened and a presser ring 100.