MANUFACTURING METHOD OF GLASS CERAMIC SUBSTRATE

PROBLEM TO BE SOLVED: To provide the manufacturing method of a glass ceramic substrate with less variation in adhesion density of a wiring pattern to be attached later being formed on the surface of the glass ceramic substrate. SOLUTION: The manufacturing method of a glass ceramic substrate where a wiring conductor is formed after laminating a plurality of ceramic green sheets 21-24 whose sintering temperature is 800-1,000 deg.C before burning comprises a first process for placing non-sintered sheets 27 and 28 that are not sintered at the sintering temperature above and below the laminated ceramic green sheets 21-24, and heating and crimping the non-sintered sheets 27 and 28 for forming, a second process for forming a burning body 30 by pressing and burning a laminate 20 at a sintering temperature, a third process for removing the non-sintered sheets 27 and 28 from the burning body 30, a fourth process for performing the blast treatment of the surface of the burning body 30 where the non-sintered sheets 27 and 28 have been removed and forming the surface roughness to 1.5 μmRa or more, and a fifth process for printing and burning an outer-layer printed pattern 11 on the surface that is subjected to blast treatment.