ADHESIVE TAPE FOR PRODUCING SEMICONDUCTOR

ADHESIVE TAPE FOR PRODUCING SEMICONDUCTOR

PROBLEM TO BE SOLVED: To obtain an adhesive tape for producing a semiconductor, by quickly removing static electricity generated in a process for producing a semiconductor wafer, preventing electrification of an adhesive tape by extrapure water used in the process, not causing problems such as an en...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MIYAKO TAKEOMI, TAIMA KAZUO
Format: Patent
Sprache:eng
Schlagworte:
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
PERFORMING OPERATIONS
POLISHES
TRANSPORTING
USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To obtain an adhesive tape for producing a semiconductor, by quickly removing static electricity generated in a process for producing a semiconductor wafer, preventing electrification of an adhesive tape by extrapure water used in the process, not causing problems such as an environmental pollution resulting from adsorption of circumambient dirt, dust, cut powder, etc., wafer stain by electroconductive substances, destruction of electric circuit, etc. SOLUTION: This adhesive tape 10 for producing a semiconductor is obtained by successively laminating a water-resistant antistatic layer 14A and an adhesive layer 16 to a substrate 12. The water-resistant antistatic layer 14A is preferably composed of a synthetic resin obtained by crosslinking a polymer compound containing a reactive group to be combined with a crosslinking agent and an ionic conductive group on the side chains with a crosslinking agent containing a bifunctional or polyfunctional reactive group.