SEALING FORMATION METHOD OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To achieve a method for sealing and forming a semiconductor device without deformation and warpage. SOLUTION: This sealing formation method of the semiconductor device includes: a step that mounts the bottom surface of the multiple matching substrate of a semiconductor chip where a number of chips are mounted to a deformation inhibition plate; a step that surrounds the periphery of the substrate by a weir for preventing the outflow of a liquid resin for sealing; a step for impregnating a liquid resin for sealing into the weir; a step that covers the liquid level of the impregnated resin with a lid plate and fixes the lid plate, substrate, weir, and deformation inhibition plate in one piece before inverting; a step that cures the resin; a step that dismantles the lid plate, substrate, weir, and deformation inhibition plate after curing; and a step that divides the substrate into each chip.