ROTARY WAFER TREATMENT DEVICE
PROBLEM TO BE SOLVED: To avoid a phenomenon that a chemical agent remains on the rear surface of a wafer after washing and drying the wafer in wafer treatment where a chemical agent is supplied to surfaces of a wafer while rotating the wafer by a rotor. SOLUTION: As a washing means, there are provid...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!