ROTARY WAFER TREATMENT DEVICE

PROBLEM TO BE SOLVED: To avoid a phenomenon that a chemical agent remains on the rear surface of a wafer after washing and drying the wafer in wafer treatment where a chemical agent is supplied to surfaces of a wafer while rotating the wafer by a rotor. SOLUTION: As a washing means, there are provid...

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Bibliographische Detailangaben
Hauptverfasser: FUJINE OSAMU, NAKADA KATSUTOSHI
Format: Patent
Sprache:eng
Schlagworte:
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