ROTARY WAFER TREATMENT DEVICE

PROBLEM TO BE SOLVED: To avoid a phenomenon that a chemical agent remains on the rear surface of a wafer after washing and drying the wafer in wafer treatment where a chemical agent is supplied to surfaces of a wafer while rotating the wafer by a rotor. SOLUTION: As a washing means, there are provid...

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Bibliographische Detailangaben
Hauptverfasser:	FUJINE OSAMU, NAKADA KATSUTOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY CLEANING CLEANING IN GENERAL DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY FREQUENCY-CHANGING HOLOGRAPHY MATERIALS THEREFOR NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To avoid a phenomenon that a chemical agent remains on the rear surface of a wafer after washing and drying the wafer in wafer treatment where a chemical agent is supplied to surfaces of a wafer while rotating the wafer by a rotor. SOLUTION: As a washing means, there are provided a spray nozzle 80 for spraying a surface of a wafer 10 with pure water, a pure water nozzle 50 for spraying the rear surface of the wafer 10 with pure water and a pure water nozzle 60 for spraying the outer periphery of the rear surface of a rotor 20 with pure water. By washing the outer periphery of the rear surface of the rotor 20 upon washing, reattachment of a chemical agent from the outer periphery of the rear surface of the rotor 20 to the rear surface of the wafer 10 is prevented.