METHOD FOR COVERING SELF-SUSTAINING MICRO MACHINE DEVICE

PROBLEM TO BE SOLVED: To cover a device without damaging it structurally. SOLUTION: This method is used for covering a self-sustaining micro machine device 302 using rotation covering. Solution with high solid charge quantity and low viscosity can infiltrate into a free section 304 of a micromachini...

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Bibliographische Detailangaben
Hauptverfasser:	LOPES VINCENT C, MILLER SETH
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PERFORMING OPERATIONS PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To cover a device without damaging it structurally. SOLUTION: This method is used for covering a self-sustaining micro machine device 302 using rotation covering. Solution with high solid charge quantity and low viscosity can infiltrate into a free section 304 of a micromachining structure. When the solution is removed from a wafer or a die by rotation, a film is formed on the device without any estimated damage by the capillary action. When an organic copolymer is used as a solid component, the structure is released from a mold by a conventional ashing process. This method can be used for protecting the structure to be tested released from the mold and solving the deformation due to the sticking of the micro machine device in a wet mold release process in manufacturing the micro machine device.