HIGH RIGIDITY THERMOPLASTIC POLYESTER RESIN COMPOSITION WITH GOOD MOLD SURFACE TRANSFER

PROBLEM TO BE SOLVED: To provide a high rigidity thermoplastic resin composition which gives products usable for exterior parts without coating, as it has high mechanical strength, rigidity, heat resistance, and an excellent transfer characteristic of embossing decoration of mold surface. SOLUTION:...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	IBA TOSHIAKI, UEDA MISUZU, NAKANO KIMIHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a high rigidity thermoplastic resin composition which gives products usable for exterior parts without coating, as it has high mechanical strength, rigidity, heat resistance, and an excellent transfer characteristic of embossing decoration of mold surface. SOLUTION: This thermoplastic polyester resin composition is a mixture of (A) 100 pts.wt. of a thermoplastic polyester resin, (B) 5-80 pts.wt. of an acrylic resin having 3 g/10 min or more of a melt index at 230 deg.C and (C) 50-400 pts.wt. of an inorganic reinforcing filler, and the inorganic reinforcing filler (C) contains at least 50 wt.% of fibrous reinforcing material.