ROTARY SUBSTRATE TREATMENT APPARATUS

PROBLEM TO BE SOLVED: To prevent the lowering of the treatment rate and non-uniformity of a chemical liquid supplied to the surface of a substrate caused by the lowering of temperature, in the treatment of the substrate for supplying the chemical liquid to the surface of the substrate while rotating...

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Bibliographische Detailangaben
Hauptverfasser:	FUJINE OSAMU, NAKADA KATSUTOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR NOZZLES ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To prevent the lowering of the treatment rate and non-uniformity of a chemical liquid supplied to the surface of a substrate caused by the lowering of temperature, in the treatment of the substrate for supplying the chemical liquid to the surface of the substrate while rotating the substrate by a rotor. SOLUTION: A cooling fan 30 for forming a down flow in a treatment tank 20 is constituted in a speed changeable manner and an on-off damper 73 is provided to an exhaust system 70 for evacuating the treatment tank 20. When treating with the chemical liquid, the on-off damper 73 is closed and the cooling fan 30 is rotated at a low speed so as to make suction quantity slightly larger than exhaustion quantity.