ION DOPING DEVICE AND SEMICONDUCTOR

PROBLEM TO BE SOLVED: To provide an ion doping device capable of reducing particles. SOLUTION: The inside of a plasma chamber 12 is subjected to a convex/ concave processing. Thereby, particles deposited in the plasma chamber 12 are hardly peeled off to inhibit a generation of the particles in the p...

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Hauptverfasser: KASHIRO TAKESHI, SHIBATA MITSURU
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creator KASHIRO TAKESHI
SHIBATA MITSURU
description PROBLEM TO BE SOLVED: To provide an ion doping device capable of reducing particles. SOLUTION: The inside of a plasma chamber 12 is subjected to a convex/ concave processing. Thereby, particles deposited in the plasma chamber 12 are hardly peeled off to inhibit a generation of the particles in the plasma chamber 12.
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subjects BASIC ELECTRIC ELEMENTS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SEMICONDUCTOR DEVICES
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
title ION DOPING DEVICE AND SEMICONDUCTOR
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