COVER FILM FOR PHOTORESIST

PROBLEM TO BE SOLVED: To obtain a cover film which further improves the accuracy and electrical reliability of a wiring pattern on a print wiring board. SOLUTION: The cover film consists of a biaxially oriented polypropylene film, having a smooth face on one surface and a roughened face on the other...

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Bibliographische Detailangaben
1. Verfasser:	ARAKI TETSUO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a cover film which further improves the accuracy and electrical reliability of a wiring pattern on a print wiring board. SOLUTION: The cover film consists of a biaxially oriented polypropylene film, having a smooth face on one surface and a roughened face on the other surface. The surface roughness of the smooth surface is