METHOD FOR APPLYING RELEASE AGENT TO MOLD AND MOLDING SYSTEM

PROBLEM TO BE SOLVED: To provide a method for applying a release agent to a mold, capable of preventing the supercooling of the mold, shortening a molding cycle, preventing the deterioration of work environment and extending the life of the mold and, a molding system. SOLUTION: The nozzle receiving...

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Hauptverfasser: SATO KOICHIRO, MIYAZAKI MITSUTOSHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for applying a release agent to a mold, capable of preventing the supercooling of the mold, shortening a molding cycle, preventing the deterioration of work environment and extending the life of the mold and, a molding system. SOLUTION: The nozzle receiving surface, which is opposed to a material supply nozzle with respect to a molding cavity 10, is connected to the fixed mold 11 of the mold 1. In applying the release agent to the material contact surface 100 of the mold 1, both of them are brought to a state arranged in opposed relationship at an interval not exceeding an interval enabling the release of a molded article and the release agent is supplied to the material contact surface 100 through the gap between the material supply nozzle and the nozzle receiving surface 131.