REFLOW SOLDERING DEVICE

PROBLEM TO BE SOLVED: To provide a reflow soldering device capable of switching a heating mode for performing reflow soldering while efficiently heating the upper and lower surfaces of a printed wiring board and a cooling mode for efficiently cooling one side while efficiently heating the other side...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	SAWABE HIROSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a reflow soldering device capable of switching a heating mode for performing reflow soldering while efficiently heating the upper and lower surfaces of a printed wiring board and a cooling mode for efficiently cooling one side while efficiently heating the other side and performing reflow soldering. SOLUTION: A heating chamber 3 for performing reflow soldering by heating a printed wiring board 1 is provided so as to freely move back and forth with respect to the printed wiring board 1. Then, air blowing port 21 and an air exhausting port 22 are opened for ventilating cold air along with the surface of the printed wiring board 1 when the heating chamber leaves the printed wiring board, and an interlocked opening/closing means is provided for closing these ports when the heating chamber enters the printed wiring board.