MODULE STRUCTURE

MODULE STRUCTURE

PROBLEM TO BE SOLVED: To provide a heat-radiating component which has high reliability and superior heat radiation characteristics at low cost. SOLUTION: This is a module structure formed by joining a ceramic circuit board with an aluminum-silicon carbide composite. The yield of the aluminum- silico...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TERASAKI RYUICHI, HIROTSURU HIDEKI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a heat-radiating component which has high reliability and superior heat radiation characteristics at low cost. SOLUTION: This is a module structure formed by joining a ceramic circuit board with an aluminum-silicon carbide composite. The yield of the aluminum- silicon carbide composite is 1.5 to 4 times as large as that of the aluminum in the aluminum-silicon carbide composite, or the Young's modulus of the aluminum-silicon carbide composite is 120 to 200 GPa.