DEVICE AND METHOD FOR APPLYING BONDING PASTE

PROBLEM TO BE SOLVED: To provide a device and a method for applying bonding paste, capable of superior operability and obtaining satisfactory application quality. SOLUTION: In this bonding paste applying method for plotting and applying the bonding paste, while discharging the bonding paste from an applying nozzle, a plotting pattern used for the control of a moving means for moving the applying nozzle is generated by a plotting pattern calculation part 44, based on the size of an object chip and a basic shape pattern for specifying the plotting shape of the plotting pattern stored in a storage part 37 beforehand and the speed pattern of the moving means is calculated by a speed pattern calculation part 45, based on the generated plotting pattern and is mode to be stored in a speed pattern storage part 46. Thus, an appropriate plotting pattern is set, corresponding to the kind and size of the chip with superior operability and the appropriate paste is applied efficiently.