SPUTTERING TARGET AND MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a sputtering target, by which target cracking during sputtering can be reduced. SOLUTION: The sputtering target is constituted of a backing plate, a target member and a solder metal for joining them, and the surface roughness (Ra) of the target member at the joining...

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Bibliographische Detailangaben
Hauptverfasser:	UCHIUMI KENTARO, KUROSAWA SATOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a sputtering target, by which target cracking during sputtering can be reduced. SOLUTION: The sputtering target is constituted of a backing plate, a target member and a solder metal for joining them, and the surface roughness (Ra) of the target member at the joining surface to be joined to the backing plate is regulated to >=0.5 μm. The target can be obtained by regulating the Ra of the target member at the joining surface to be joined to the backing plate to >=0.5 μm by the shot of a blasting material and then joining the target member and the backing plate by the use of the solder metal.