PRINTED CIRCUIT BOARD AND ITS MANUFACTURING METHOD
PROBLEM TO BE SOLVED: To provide a printed circuit board having a flexibility and a superior solder heat resistance. SOLUTION: The printed circuit board is composed of a polyimide type plastic base film 1 and a pattern circuit 2 formed on the base film 1 with a conductive paste containing a polyimid...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | IMAI TAKAYUKI ONO AKINOBU NAKAJIMA TOSHIFUMI JUMONJI SADAMITSU |
| description | PROBLEM TO BE SOLVED: To provide a printed circuit board having a flexibility and a superior solder heat resistance. SOLUTION: The printed circuit board is composed of a polyimide type plastic base film 1 and a pattern circuit 2 formed on the base film 1 with a conductive paste containing a polyimide region as a binder. Owing to the polyimide type resin binder, a flexibility is provided and a high solder heat resistance is obtained. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2002026474A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2002026474A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2002026474A3</originalsourceid><addsrcrecordid>eNrjZDAKCPL0C3F1UXD2DHIO9QxRcPJ3DHJRcPRzUfAMCVbwdfQLdXN0DgkFqnJX8HUN8fB34WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgYGRgZGZibmJo7GRCkCAL0OJyw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PRINTED CIRCUIT BOARD AND ITS MANUFACTURING METHOD</title><source>esp@cenet</source><creator>IMAI TAKAYUKI ; ONO AKINOBU ; NAKAJIMA TOSHIFUMI ; JUMONJI SADAMITSU</creator><creatorcontrib>IMAI TAKAYUKI ; ONO AKINOBU ; NAKAJIMA TOSHIFUMI ; JUMONJI SADAMITSU</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a printed circuit board having a flexibility and a superior solder heat resistance. SOLUTION: The printed circuit board is composed of a polyimide type plastic base film 1 and a pattern circuit 2 formed on the base film 1 with a conductive paste containing a polyimide region as a binder. Owing to the polyimide type resin binder, a flexibility is provided and a high solder heat resistance is obtained.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CONDUCTORS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INSULATORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020125&DB=EPODOC&CC=JP&NR=2002026474A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020125&DB=EPODOC&CC=JP&NR=2002026474A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>IMAI TAKAYUKI</creatorcontrib><creatorcontrib>ONO AKINOBU</creatorcontrib><creatorcontrib>NAKAJIMA TOSHIFUMI</creatorcontrib><creatorcontrib>JUMONJI SADAMITSU</creatorcontrib><title>PRINTED CIRCUIT BOARD AND ITS MANUFACTURING METHOD</title><description>PROBLEM TO BE SOLVED: To provide a printed circuit board having a flexibility and a superior solder heat resistance. SOLUTION: The printed circuit board is composed of a polyimide type plastic base film 1 and a pattern circuit 2 formed on the base film 1 with a conductive paste containing a polyimide region as a binder. Owing to the polyimide type resin binder, a flexibility is provided and a high solder heat resistance is obtained.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CONDUCTORS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAKCPL0C3F1UXD2DHIO9QxRcPJ3DHJRcPRzUfAMCVbwdfQLdXN0DgkFqnJX8HUN8fB34WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgYGRgZGZibmJo7GRCkCAL0OJyw</recordid><startdate>20020125</startdate><enddate>20020125</enddate><creator>IMAI TAKAYUKI</creator><creator>ONO AKINOBU</creator><creator>NAKAJIMA TOSHIFUMI</creator><creator>JUMONJI SADAMITSU</creator><scope>EVB</scope></search><sort><creationdate>20020125</creationdate><title>PRINTED CIRCUIT BOARD AND ITS MANUFACTURING METHOD</title><author>IMAI TAKAYUKI ; ONO AKINOBU ; NAKAJIMA TOSHIFUMI ; JUMONJI SADAMITSU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2002026474A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CONDUCTORS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><toplevel>online_resources</toplevel><creatorcontrib>IMAI TAKAYUKI</creatorcontrib><creatorcontrib>ONO AKINOBU</creatorcontrib><creatorcontrib>NAKAJIMA TOSHIFUMI</creatorcontrib><creatorcontrib>JUMONJI SADAMITSU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>IMAI TAKAYUKI</au><au>ONO AKINOBU</au><au>NAKAJIMA TOSHIFUMI</au><au>JUMONJI SADAMITSU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PRINTED CIRCUIT BOARD AND ITS MANUFACTURING METHOD</title><date>2002-01-25</date><risdate>2002</risdate><abstract>PROBLEM TO BE SOLVED: To provide a printed circuit board having a flexibility and a superior solder heat resistance. SOLUTION: The printed circuit board is composed of a polyimide type plastic base film 1 and a pattern circuit 2 formed on the base film 1 with a conductive paste containing a polyimide region as a binder. Owing to the polyimide type resin binder, a flexibility is provided and a high solder heat resistance is obtained.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JP2002026474A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES |
| title | PRINTED CIRCUIT BOARD AND ITS MANUFACTURING METHOD |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T07%3A39%3A05IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=IMAI%20TAKAYUKI&rft.date=2002-01-25&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2002026474A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |