PRINTED CIRCUIT BOARD AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a printed circuit board having a flexibility and a superior solder heat resistance. SOLUTION: The printed circuit board is composed of a polyimide type plastic base film 1 and a pattern circuit 2 formed on the base film 1 with a conductive paste containing a polyimid...

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Bibliographische Detailangaben
Hauptverfasser:	IMAI TAKAYUKI, ONO AKINOBU, NAKAJIMA TOSHIFUMI, JUMONJI SADAMITSU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a printed circuit board having a flexibility and a superior solder heat resistance. SOLUTION: The printed circuit board is composed of a polyimide type plastic base film 1 and a pattern circuit 2 formed on the base film 1 with a conductive paste containing a polyimide region as a binder. Owing to the polyimide type resin binder, a flexibility is provided and a high solder heat resistance is obtained.