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PROBLEM TO BE SOLVED: To enable usage of a pattern of the wiring layer of the same design for variety of specifications. SOLUTION: A wiring layer is formed on the glass substrate 1, and an anode wiring and a grid wiring are included in the wiring layer. For the anode wiring 2-A to 2-D, 2-a to 2-d pr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KAWAMURA SHINYA, NISHII KIYOSHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To enable usage of a pattern of the wiring layer of the same design for variety of specifications. SOLUTION: A wiring layer is formed on the glass substrate 1, and an anode wiring and a grid wiring are included in the wiring layer. For the anode wiring 2-A to 2-D, 2-a to 2-d provided N channels are provided in advance, corresponding to the maximum number N of the drivers, which is possible to be mounted on the glass substrate. For each anode wiring, wiring pads A1-A4, B1-B4, C1-C4, D1-D4, a1-a4, b1-b4, c1-c4, d1-d4, which are capable of becoming a formation place of a through-hole, plural pieces are formed in advance so that the arrangement pattern of the anode electrode and the arrangement pattern of the through- holes, corresponding to each anode electrode, can be freely selected.