SYSTEM FOR ACQUIRING AND MANAGING WAFER MANUFACTURING DATA

PROBLEM TO BE SOLVED: To provide a semiconductor processing apparatus, provided with at least one sensor and a tool, having a first data communication port and a second data communication port. SOLUTION: A sensor data acquiring subsystem (808) acquires sensor data from the tool via a second port (80...

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Bibliographische Detailangaben
Hauptverfasser: NISHIMURA YUKARI, LYON RICHARD C, CORDOVA SHERRY, NOLET CLARICE M, KROUPNOVA NATALIA, REISS TERRY, MICHAEL E WILLMER, LOBOVSKI EVGUENI, TOH WOON YOUNG, DOYLE TERRY, LOUNEVA INNA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a semiconductor processing apparatus, provided with at least one sensor and a tool, having a first data communication port and a second data communication port. SOLUTION: A sensor data acquiring subsystem (808) acquires sensor data from the tool via a second port (806). The data-acquiring subsystem (808) acquires an MES operation message via a first port (804). The sensor data are communicated to a sensor processing unit (828) of a sensor data processing subsystem (810). The sensor processing unit (828) processes and analyzes the sensor data. Furthermore, the processing unit (828) can be suited to determine a product or processing relation, such as to operate an alarm, when a process is not operated within a management limit, for example. In another embodiment, a method and a device are provided for processing data from a wafer manufacturing facility (1000) provided with plural tools respectively, having first data communication ports (1012-1018) and second data communication ports (1042-1048).